Full-turnkey analog and mixed-signal design, layout, MPW runs, packaging, and high-reliability testing.
For high-volume B2B customers and niche industrial/automotive systems, standard off-the-shelf catalog chips may not meet specific parameters. Cosine Nanoelectronics provides dedicated ODM custom silicon development, integrating multiple components (like transceivers, LDOs, and op-amps) into a single, cost-effective ASIC die.
We oversee the entire product life cycle from conceptual architecture design to foundry mask tape-out, packaging engineering, and validation. This significantly reduces your PCB space, power consumption, and bill-of-materials (BOM) complexity.
Our Specialty Areas: Custom analog front-ends (AFEs) for sensors, low-noise amplifiers, wide-input power management, and industrial bus transceivers with high galvanic isolation.
Our structured execution flow from initial specification parameters to volume chip delivery.
Defining target voltages, frequencies, noise limits, and pins configuration.
Schematic capture, Spice transient simulation, and Monte Carlo corner runs.
Physical silicon mask layout design, routing, matching, and DRC/LVS checks.
Releasing GDSII data to foundry (TSMC/SMIC) for MPW runs or dedicated masks.
Enclosing silicon dies into standard SOP, MSOP, SOT, or custom leadless QFNs.
Wafer sort testing (CP), final package test (FT), and validation evaluation boards.
